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Title:
RESIN COMPOSITION FOR FORMING UNDERLAYER FILM, LAMINATE, PATTERN FORMING METHOD, KIT FOR FORMING IMPRINT, AND METHOD FOR MANUFACTURING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/152600
Kind Code:
A1
Abstract:
Provided are: a resin composition for forming an underlayer film, which is capable of improving mold releasability when a mold is separated from a cured product layer of a photocurable composition; a laminate; a pattern forming method; a kit for forming an imprint; and a method for manufacturing a device. This resin composition for forming an underlayer film contains a resin, a mold release agent that has at least one group selected from among ionic groups and silane coupling groups, and a solvent.

Inventors:
OOMATSU TADASHI (JP)
KITAGAWA HIROTAKA (JP)
GOTO YUICHIRO (JP)
Application Number:
PCT/JP2016/057907
Publication Date:
September 29, 2016
Filing Date:
March 14, 2016
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C09D201/00; B29C59/02; B32B27/00; C08F299/00; C08K5/00; C08L101/00; C09D5/00; C09D7/12; H01L21/027
Domestic Patent References:
WO2016031879A12016-03-03
Foreign References:
JP2014192178A2014-10-06
JP2014003123A2014-01-09
JP2011159924A2011-08-18
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
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