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Patent Searching and Data


Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/220663
Kind Code:
A1
Abstract:
A resin composition according to one aspect of the present invention contains an acrylic resin obtained by polymerizing a monomer component containing: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a reactive group. [In formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.]

Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
Application Number:
PCT/JP2018/042156
Publication Date:
November 21, 2019
Filing Date:
November 14, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L33/14; C08F220/28; C08G18/81; C08K7/16; C08L63/00; C09K5/06
Foreign References:
JP2004002829A2004-01-08
JP2005501960A2005-01-20
JP2008163286A2008-07-17
JP2010501671A2010-01-21
JP2011132421A2011-07-07
JP2008106164A2008-05-08
JP2009029985A2009-02-12
JPH1180723A1999-03-26
JP2001200246A2001-07-24
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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