Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/220663
Kind Code:
A1
Abstract:
A resin composition according to one aspect of the present invention contains an acrylic resin obtained by polymerizing a monomer component containing: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a reactive group. [In formula (1), R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.]
Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
Application Number:
PCT/JP2018/042156
Publication Date:
November 21, 2019
Filing Date:
November 14, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L33/14; C08F220/28; C08G18/81; C08K7/16; C08L63/00; C09K5/06
Foreign References:
JP2004002829A | 2004-01-08 | |||
JP2005501960A | 2005-01-20 | |||
JP2008163286A | 2008-07-17 | |||
JP2010501671A | 2010-01-21 | |||
JP2011132421A | 2011-07-07 | |||
JP2008106164A | 2008-05-08 | |||
JP2009029985A | 2009-02-12 | |||
JPH1180723A | 1999-03-26 | |||
JP2001200246A | 2001-07-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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