Title:
RESIN COMPOSITION, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/021959
Kind Code:
A1
Abstract:
An aspect of the present invention provides a resin composition containing an acrylic resin which is obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer which is copolymerizable with the first monomer and has a block isocyanate group. (In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents an alkyl group having 12-30 carbon atoms.)
More Like This:
| WO/2003/071339 | POLYMERIZATION PROCESS AND MATERIALS FOR BIOMEDICAL APPLICATIONS |
| JP3880995 | RESIN PARTICLE |
| JP2598994 | [Title of Invention] Photosensitive assembly |
Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
NAGAI AKIRA (JP)
MATSUBARA NOZOMI (JP)
MORIMOTO TSUYOSHI (JP)
NAGAI AKIRA (JP)
MATSUBARA NOZOMI (JP)
Application Number:
PCT/JP2019/025735
Publication Date:
January 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L33/06; C08G18/80; C08K5/05; C08K5/17; C08L33/14; C09K5/06
Domestic Patent References:
| WO2015064360A1 | 2015-05-07 |
Foreign References:
| JP2002066206A | 2002-03-05 | |||
| JP2002322465A | 2002-11-08 | |||
| JP2005513245A | 2005-05-12 | |||
| JP2010126654A | 2010-06-10 | |||
| JP2010197442A | 2010-09-09 | |||
| JP2008201850A | 2008-09-04 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: