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Patent Searching and Data


Title:
RESIN COMPOSITION FOR INJECTION MOLDING
Document Type and Number:
WIPO Patent Application WO/2019/065748
Kind Code:
A1
Abstract:
The present invention provides: a resin composition for injection molding, which can produce a molded body that exhibits excellent thermal stability, thermal fluidity and high water pressure resistance without using heavy metals such as lead and tin; and a molded body obtained by using the resin composition for injection molding. The present invention is a resin composition for injection molding, which contains a chlorinated vinyl chloride-based resin, a vinyl chloride-based resin and a thermal stabilizer, wherein the thermal stabilizer contains a calcium alkylcarboxylate and a zinc compound, the vinyl chloride-based resin has a degree of polymerization of 400-1000, and the vinyl chloride-based resin is contained at a quantity of 1-30 parts by mass relative to 100 parts by mass of the chlorinated vinyl chloride-based resin.

Inventors:
TANIGUCHI HIROSHI (JP)
MASHINO NORIKAZU (JP)
GOTOU TSUKASA (JP)
MOCHIZUKI HIROAKI (JP)
Application Number:
PCT/JP2018/035721
Publication Date:
April 04, 2019
Filing Date:
September 26, 2018
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
TOKUYAMA SEKISUI CO LTD (JP)
International Classes:
C08L27/24; B29C45/00; C08F8/20; C08K5/098; C08L27/06
Domestic Patent References:
WO2016013638A12016-01-28
WO2012160943A12012-11-29
WO2013080563A12013-06-06
WO2008018521A12008-02-14
WO2016013638A12016-01-28
Foreign References:
JP2010265365A2010-11-25
JP2004099697A2004-04-02
JP2003292712A2003-10-15
JP2002226659A2002-08-14
JP2000086732A2000-03-28
JPH08127688A1996-05-21
JP2004231718A2004-08-19
JP2008214466A2008-09-18
JP2008535997A2008-09-04
Other References:
R. A. KOMOROSKIR. G. PARKERJ. P. SHOCKER, MACROMOLECULES, vol. 18, 1985, pages 1257 - 1265
See also references of EP 3689963A4
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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