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Patent Searching and Data


Title:
RESIN COMPOSITION FOR LASER DIRECT STRUCTURING, MOLDED PRODUCT, AND PRODUCTION METHOD OF PLATED MOLDED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/090824
Kind Code:
A1
Abstract:
A resin composition for laser direct structuring, which has a low loss tangent and on which plating can be formed, a molded product, and a production method of a plated molded product are provided. This resin composition for laser direct structuring contains a polycarbonate resin and a laser direct structuring additive, wherein at least 5 mass% of all constituent units of the polycarbonate resin are represented by formula (1). In formula (1), R1 and R2 are independently a hydrogen atom or a methyl group, and W1 represents a single bond or a divalent group.

Inventors:
KIKUCHI TATSUYA (JP)
Application Number:
PCT/JP2020/041158
Publication Date:
May 14, 2021
Filing Date:
November 04, 2020
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
International Classes:
C08G64/04; C08K3/013; C08K3/22; C08L69/00; H01P11/00; H01Q1/38
Domestic Patent References:
WO2013018835A12013-02-07
WO2009141800A22009-11-26
WO2012128219A12012-09-27
WO2019078162A12019-04-25
Foreign References:
JP2014221850A2014-11-27
JP2015074676A2015-04-20
JP2015108124A2015-06-11
JP2013018240A2013-01-31
JPH08183852A1996-07-16
JP2000503817A2000-03-28
JP2004534408A2004-11-11
JP2019172712A2019-10-10
JP2017110180A2017-06-22
JP2016216534A2016-12-22
JP2011219620A2011-11-04
JP2011195820A2011-10-06
JP2011178873A2011-09-15
JP2011168705A2011-09-01
JP2011148267A2011-08-04
Other References:
See also references of EP 4056624A4
Attorney, Agent or Firm:
SIKs & Co. (JP)
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