Title:
RESIN COMPOSITION, RESIN LAYER, AND LAYERED SHEET
Document Type and Number:
WIPO Patent Application WO/2019/130822
Kind Code:
A1
Abstract:
Provided are a resin layer capable of strongly adhering to a rough surface and to a plastic, the resin layer having high holding power and exhibiting good adhesion even at low temperature, a resin composition suitable for forming the resin layer, and a layered sheet including the resin layer. The resin composition provided by the present invention contains a (meth)acrylic polymer having a Tg of -40°C or below, and 5-40 parts by weight of a tackifying resin with respect to 100 parts by weight of the (meth)acrylic polymer. The (meth)acrylic polymer is a polymer of monomer components including: 50-97 wt% of an alkyl (meth)acrylate (A1) having a C8-18 branched alkyl group at a terminal end of an ester group, a homopolymer of the alkyl (meth)acrylate (A1) having a Tg of -50°C or below; and 3-50 wt% of a (meth)acrylate (A2) having an ether bond in the molecular skeleton thereof, a homopolymer of the (meth)acrylate (A2) having a Tg of -40°C or below.
Inventors:
HIGASHI MASATSUGU (JP)
Application Number:
PCT/JP2018/040971
Publication Date:
July 04, 2019
Filing Date:
November 05, 2018
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08L33/06; B32B27/00; B32B27/30; C08L25/06; C08L57/02; C08L93/04; C08L101/12; C09J7/38; C09J11/06; C09J133/06; C09J133/14
Foreign References:
| JP2008280375A | 2008-11-20 | |||
| JP2008069261A | 2008-03-27 | |||
| JP2017095598A | 2017-06-01 | |||
| JP2015187261A | 2015-10-29 | |||
| JP2013159662A | 2013-08-19 | |||
| JP2003277709A | 2003-10-02 | |||
| JP2018130934A | 2018-08-23 | |||
| JP2018016785A | 2018-02-01 |
Attorney, Agent or Firm:
OI, Michiko (JP)
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