Title:
RESIN COMPOSITION, METAL FOIL WITH RESIN, CURED PRODUCT, METAL BASE SUBSTRATE, AND ELECTRONIC PARTS
Document Type and Number:
WIPO Patent Application WO/2022/163609
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of finding: an electrical insulating layer for a metal base substrate used for electronic devices, in particular on-board electronic devices, the electrical insulating layer having a high electrical insulating capacity, high heat conductivity, low elasticity, and high resistance to soldering heat; and a resin composition which is the pre-curing form of the electrical insulating layer, the resin composition exhibiting good workability when applied to a body to be coated. [Solution] The problem is solved by providing: a heat-curable resin composition, a cured product, and a metal foil with a resin, which are characterized by containing (A) a rubber-like polymeric compound having a glass transition temperature (Tg) of -40֯C or less, and a weight average molecular weight (Mw) of 8,000-50,000, (B) an epoxy resin, (C) a filler, and (D) a phenoxy resin; a method for producing a metal base substrate having the foregoing; and a method for producing electronic parts using said metal base substrate. [Selected drawing] FIG. 1
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Inventors:
DAIGO YOSHIKAZU (JP)
Application Number:
PCT/JP2022/002547
Publication Date:
August 04, 2022
Filing Date:
January 25, 2022
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
B32B25/14; B32B15/08; C08K3/01; C08L9/00; C08L21/00; C08L63/00; C08L71/10; H05K1/03; H05K1/05
Domestic Patent References:
| WO2005006826A1 | 2005-01-20 | |||
| WO2020152906A1 | 2020-07-30 |
Foreign References:
| JPH1117346A | 1999-01-22 | |||
| JP2006273954A | 2006-10-12 | |||
| JP2017084949A | 2017-05-18 | |||
| JP2019166688A | 2019-10-03 |
Attorney, Agent or Firm:
ETOH Toshiaki et al. (JP)
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