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Patent Searching and Data


Title:
RESIN COMPOSITION, AND RESIN MOLDED ARTICLE COMPRISING SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/187399
Kind Code:
A1
Abstract:
[Problem] To provide a resin composition that combines heat resistance and melt-molding-processing properties that compare favorably to liquid crystal polyester resins, as well as having a low dielectric loss tangent and a low dielectric constant. [Solution] The resin composition according to the present invention is characterized by containing: a liquid crystal polyester resin (A), which contains a constituent unit (I) derived from a hydroxycarboxylic acid, a constituent unit (II) derived from a diol compound, and a constituent unit (III) derived from a dicarboxylic acid; a fluororesin (B); and an inorganic hollow filler (C), the dielectric loss tangent measured by cavity resonator perturbation at a frequency of 10 GHz being at most 2×10–3, and the relative permittivity being at most 3.50.

Inventors:
ONO NOZOMI (JP)
UMEMURA YUJI (JP)
Application Number:
PCT/JP2021/010284
Publication Date:
September 23, 2021
Filing Date:
March 15, 2021
Export Citation:
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Assignee:
ENEOS CORP (JP)
International Classes:
C08K7/24; C08L27/12; C08L67/03
Domestic Patent References:
WO2018008612A12018-01-11
WO2020138277A12020-07-02
Foreign References:
JP2009114418A2009-05-28
JP2005533908A2005-11-10
JP2019065061A2019-04-25
JP2009108190A2009-05-21
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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