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Title:
RESIN COMPOSITION, RESIN MOLDED ARTICLE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/100716
Kind Code:
A1
Abstract:
A resin composition containing: polyimide resin particles (A) including repeating constituent units represented by formula (1) and repeating constituent units represented by formula (2), having a content ratio of repeating constituent units of formula (1) to the total repeating constituent units of formula (1) and repeating constituent units of formula (2) of 20–70 mol%, and a volume average particle size D50 of 5-200 μm; and at least one selected from the group consisting of a thermoplastic resin (B) and a thermosetting resin (C). (R1 is a C6–22 divalent group including at least one alicyclic hydrocarbon structure. R2 is a C5–16 divalent chain aliphatic group. X1 and X2 are each independently a C6–22 tetravalent group including at least one aromatic ring.)

Inventors:
SAKAI ATSUSHI (JP)
SATO YUUKI (JP)
KANEKO NAOKI (JP)
Application Number:
PCT/JP2020/042852
Publication Date:
May 27, 2021
Filing Date:
November 17, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B29B9/06; B29B7/48; C08J5/00; C08L79/08; C08L101/00
Domestic Patent References:
WO2016147996A12016-09-22
WO2016147997A12016-09-22
Foreign References:
JPH02199176A1990-08-07
JP2004051672A2004-02-19
JPH02206652A1990-08-16
JPH04277551A1992-10-02
JPH03137153A1991-06-11
JP2017210593A2017-11-30
Other References:
See also references of EP 4063092A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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