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Title:
RESIN COMPOSITION, AND MOLDED ARTICLE AND MULTILAYER STRUCTURE EACH COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2021/132560
Kind Code:
A1
Abstract:
A resin composition which is characterized by containing (A) an ethylene-vinyl alcohol copolymer which has an ethylene unit content of from 20% by mole to 60% by mole, (B) a divalent metal hydroxide and (C) a monovalent metal compound, and which is also characterized in that: the content of the divalent metal hydroxide (B) is from 5 ppm to 5,000 ppm; and the mass ratio of the monovalent metal compound (C) in terms of monovalent metal atoms to the divalent metal hydroxide (B) in terms of divalent metal atoms, namely C/B is from 0.025 to 100. Consequently, the present invention provides a resin composition which contains an ethylene-vinyl alcohol copolymer, while exhibiting excellent long-run properties during melt molding, and having excellent hue even in melt molding of a long period of time.

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Inventors:
HOSHIKA RINA (JP)
SHIMIZU YUJI (JP)
Application Number:
PCT/JP2020/048718
Publication Date:
July 01, 2021
Filing Date:
December 25, 2020
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08L29/04; B32B27/18; B32B27/28; C08K3/22; C08K3/32; C08K5/09; C08K5/098
Domestic Patent References:
WO2019083000A12019-05-02
WO2015174396A12015-11-19
WO2019004257A12019-01-03
Foreign References:
JP2001072823A2001-03-21
JP2001164059A2001-06-19
JPH1143571A1999-02-16
JP2012502175A2012-01-26
JPH05255555A1993-10-05
JPS61243875A1986-10-30
JP2012031405A2012-02-16
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
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