Title:
RESIN COMPOSITION AND MOLDED ARTICLE USING SAID COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/117531
Kind Code:
A1
Abstract:
A resin composition containing a tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (A) and an inorganic acid acceptor (B), wherein the contained amount of the inorganic acid acceptor (B) in the resin composition is 0.01-0.1 parts by mass with respect to 100 parts by mass of the tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (A).
Inventors:
YASUMOTO NORIAKI (JP)
TAKANO KEIJI (JP)
TAKANO KEIJI (JP)
Application Number:
PCT/JP2020/044485
Publication Date:
June 17, 2021
Filing Date:
November 30, 2020
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08K5/09; B29C48/08; C08K3/22; C08K3/26; C08L27/20
Domestic Patent References:
| WO2014156824A1 | 2014-10-02 | |||
| WO2015114983A1 | 2015-08-06 | |||
| WO2019070040A1 | 2019-04-11 |
Foreign References:
| JP2007084606A | 2007-04-05 | |||
| JP2016195165A | 2016-11-17 | |||
| JP2017045638A | 2017-03-02 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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