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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/045260
Kind Code:
A1
Abstract:
Provided are a resin composition and a molded article excellent in not only heat dissipation but also moldability. A resin composition containing a fluorine resin and boron nitride particles, wherein the resin composition is characterized in that the fluorine resin is 35-70 mass% and the boron nitride particles are 30-65 mass% relative to the resin composition, and the melt flow rate of the resin composition is 5.0 g/10 min or higher.

Inventors:
MUKAE HIROFUMI (JP)
KONO HIDEKI (JP)
KOMORI MASAJI (JP)
ITO HIROSHI (JP)
Application Number:
PCT/JP2019/032948
Publication Date:
March 05, 2020
Filing Date:
August 23, 2019
Export Citation:
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Assignee:
DAIKIN IND LTD (JP)
International Classes:
C08L27/12; B29C45/00; C08K3/38; C08L27/18
Domestic Patent References:
WO2014115624A12014-07-31
Foreign References:
JP2016098301A2016-05-30
JP2015168783A2015-09-28
JP2016098301A2016-05-30
JP2015168783A2015-09-28
Other References:
See also references of EP 3828233A4
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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