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Patent Searching and Data


Title:
RESIN COMPOSITION, MOLDED BODY OF RESIN COMPOSITION, AND POWER CABLE
Document Type and Number:
WIPO Patent Application WO/2021/090578
Kind Code:
A1
Abstract:
This resin composition contains propylene and ethylene and has a melting point of 140-150°C inclusive and a heat of fusion of 60-100 J/g inclusive.

Inventors:
YAMASAKI SATOSHI (JP)
YAMAZAKI TAKANORI (JP)
IYODA FUMITOSHI (JP)
Application Number:
PCT/JP2020/034825
Publication Date:
May 14, 2021
Filing Date:
September 15, 2020
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C08L23/10; C08J7/04; H01B7/02; H01B9/00
Foreign References:
JPH09204818A1997-08-05
JP2019104895A2019-06-27
JP2006502455A2006-01-19
JP2014084389A2014-05-12
JP2006505685A2006-02-16
JP2019203149A2019-11-28
JPS5769611A1982-04-28
Other References:
See also references of EP 4056645A4
Attorney, Agent or Firm:
FUKUOKA Masahiro et al. (JP)
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