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Title:
RESIN COMPOSITION, RESIN COMPOSITION MOLDED BODY AND POWER CABLE
Document Type and Number:
WIPO Patent Application WO/2021/090579
Kind Code:
A1
Abstract:
A resin composition according to the present invention contains propylene, ethylene and styrene, while having a melting point of from 140°C to 150°C and a melting enthalpy of from 55 J/g to 90 J/g.

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JPS5819694[Title of the Invention] A polymerization constituent on the basis of stable polyolefin
Inventors:
YAMASAKI SATOSHI (JP)
YAMAZAKI TAKANORI (JP)
IYODA FUMITOSHI (JP)
Application Number:
PCT/JP2020/034826
Publication Date:
May 14, 2021
Filing Date:
September 15, 2020
Export Citation:
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Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
C08L23/12; C08J7/04; H01B7/02; H01B9/00
Domestic Patent References:
WO2006057361A12006-06-01
Foreign References:
JP2006348136A2006-12-28
JP2012107212A2012-06-07
JP2002170443A2002-06-14
JP2001106844A2001-04-17
JP2009534499A2009-09-24
JP2019203150A2019-11-28
JPS5769611A1982-04-28
Attorney, Agent or Firm:
FUKUOKA Masahiro et al. (JP)
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