Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/172448
Kind Code:
A1
Abstract:
Provided are: a resin composition from which a molded body having excellent dry gripping properties and wet gripping properties can be formed; and a molded body using said resin composition. This resin composition comprising an ethylene-vinyl acetate copolymer (I) and a hydrogenated block copolymer (II) is characterized in that: the hydrogenated block copolymer (II) is a hydrogenated product of a block copolymer (P) which contains a polymer block (A) containing an aromatic vinyl compound-derived structural unit, and a polymer block (B) containing 1-100 mass% of a farnesene-derived structural unit (b1) and 99-0 mass% of a structural unit (b2) derived from conjugated diene other than farnesene, wherein the hydrogenation rate of a carbon-carbon double bond in a conjugated diene-derived structural unit in the block copolymer (P) is at least 70 mol%; and in said resin composition, the content of the ethylene-vinyl acetate copolymer (I) is 40-95 mass%, and the content of the hydrogenated block copolymer (II) is 5-60 mass%.
Inventors:
KONISHI DAISUKE (JP)
SASAKI HIROMITSU (JP)
HASEGAWA TAKUMI (JP)
KUSUDO KAZUMASA (JP)
SASAKI HIROMITSU (JP)
HASEGAWA TAKUMI (JP)
KUSUDO KAZUMASA (JP)
Application Number:
PCT/JP2021/007152
Publication Date:
September 02, 2021
Filing Date:
February 25, 2021
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08F8/04; C08F297/04; C08L23/08; C08L31/04; C08L53/02
Domestic Patent References:
| WO2015087955A1 | 2015-06-18 |
Foreign References:
| JP2018528297A | 2018-09-27 | |||
| JP2018024776A | 2018-02-15 | |||
| JP2016113614A | 2016-06-23 | |||
| JP2007314788A | 2007-12-06 | |||
| JP2012502135A | 2012-01-26 | |||
| JP2012502136A | 2012-01-26 | |||
| JP2011132298A | 2011-07-07 |
Other References:
D.W.VAN KREVELENKLAASTE NIJENHUIS: "Properties of Polymers", 2009, ELSEVIER SCIENCE
See also references of EP 4112651A4
See also references of EP 4112651A4
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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