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Title:
RESIN COMPOSITION, MOLDED OBJECT, MODIFIER FOR POLYAMIDE-BASED RESIN, AND METHOD FOR MODIFYING POLYAMIDE-BASED RESIN
Document Type and Number:
WIPO Patent Application WO/2021/192987
Kind Code:
A1
Abstract:
This resin composition comprises a polyamide-based resin (A) and a modified ethylene/vinyl alcohol resin (B) grafted with an aliphatic polyester, the content of the modified ethylene/vinyl alcohol resin (B) being 1 part by weight or higher but lower than 50 parts by weight per 100 parts by weight of the total content of the polyamide-based resin (A) and the modified ethylene/vinyl alcohol resin (B). The resin composition has excellent moldability and gives molded objects excellent in terms of mechanical strength, particularly tensile rupture strain, while retaining intact transparency and solvent resistance.

Inventors:
ITO TAKUYA (JP)
Application Number:
PCT/JP2021/009135
Publication Date:
September 30, 2021
Filing Date:
March 09, 2021
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L51/06; C08L77/00
Foreign References:
JP2019104828A2019-06-27
JP2013245318A2013-12-09
JPH09208638A1997-08-12
JPH02245043A1990-09-28
JPS6297840A1987-05-07
JPS58129035A1983-08-01
JP2001049069A2001-02-20
JP2002337278A2002-11-27
JPS63114645A1988-05-19
JP2003213123A2003-07-30
JPH1046026A1998-02-17
JPS6490259A1989-04-06
JPS612778A1986-01-08
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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