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Title:
RESIN COMPOSITION AND MOLDED RESIN OBJECT
Document Type and Number:
WIPO Patent Application WO/2019/064626
Kind Code:
A1
Abstract:
Provided is a resin composition capable of giving molded resin objects which have excellent impact resistance and intact transparency. The resin composition comprises a cellulose ester compound (A), a poly(meth)acrylate compound (B), a polyester resin (C), and an ester compound (D) having a molecular weight of 250-2,000.

Inventors:
MIYAZAKI KANA (JP)
TANAKA RYO (JP)
MORIYAMA MASAHIRO (JP)
YAO KENJI (JP)
Application Number:
PCT/JP2018/005572
Publication Date:
April 04, 2019
Filing Date:
February 16, 2018
Export Citation:
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Assignee:
FUJI XEROX CO LTD (JP)
International Classes:
B29C45/00; C08L1/10; C08J5/18; C08K5/10; C08L33/04; C08L67/04; C08L101/00
Domestic Patent References:
WO2004087812A12004-10-14
WO2007088736A12007-08-09
WO2015076250A12015-05-28
WO2011055590A12011-05-12
Foreign References:
JP2008133445A2008-06-12
JP2010037485A2010-02-18
JP2004204217A2004-07-22
JPH06504558A1994-05-26
JP2006328368A2006-12-07
JP5298496B22013-09-25
JP2017184700A2017-10-12
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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