Title:
RESIN COMPOSITION AND RESIN MOLDED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2021/015192
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a resin composition having low thermal expansion by suppressing deterioration of a negative thermal expansion function when a negative thermal expansion material is added to a thermoplastic resin and heat-processed. The resin composition is characterized by comprising: metal oxide particles having negative thermal expansion; and a thermoplastic resin, wherein the negative thermal expansion of the particles is caused by a crystal phase transition, electron transfer between constituent metals is used as the driving force, and a covalent protective layer that inhibits electron transfer is formed between the particles and the thermoplastic resin.
Inventors:
KOJIMA TAKAHIRO (JP)
AZUMA MASAKI (JP)
SAKAI YUKI (JP)
AZUMA MASAKI (JP)
SAKAI YUKI (JP)
Application Number:
PCT/JP2020/028236
Publication Date:
January 28, 2021
Filing Date:
July 21, 2020
Export Citation:
Assignee:
CANON KK (JP)
TOKYO INST TECH (JP)
KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECH (JP)
TOKYO INST TECH (JP)
KANAGAWA INSTITUTE OF INDUSTRIAL SCIENCE AND TECH (JP)
International Classes:
C08K9/00; C08L101/12; G02B1/04; G02B5/08
Domestic Patent References:
| WO2019087722A1 | 2019-05-09 |
Foreign References:
| JP2015024945A | 2015-02-05 | |||
| JP2017048071A | 2017-03-09 | |||
| JP2013249330A | 2013-12-12 | |||
| JP2013018975A | 2013-01-31 | |||
| JP5795187B2 | 2015-10-14 | |||
| JPS6143197B2 | 1986-09-26 | |||
| JP2019135114A | 2019-08-15 |
Other References:
See also references of EP 4006096A4
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
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