Title:
RESIN COMPOSITION FOR MOLDING, AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/193079
Kind Code:
A1
Abstract:
Provided is a resin composition which is for molding and contains a polyarylene sulfide resin and from which a molded body having well-balanced mechanical strength, heat cycle characteristics, and thermal conductivity can be obtained. Specifically, provided are: a resin composition for molding, the resin composition containing, as essential components, a plate-shaped filler (A) having an aspect ratio of 10-500, a polyarylene sulfide resin (B), a thermoplastic resin (C) having a glass transition temperature (Tg) of at most 20ºC, and a glass fiber (D), wherein 30-70 parts of (A) is contained with respect to 100 parts of the total of (A)+(B)+(C)+(D) in terms of mass; and a molded body of said resin composition for molding.
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Inventors:
KANEMATSU TAKAYUKI (JP)
TAKADA SHINGO (JP)
ABE FUMIAKI (JP)
NARA SAORI (JP)
ASANO KIICHI (JP)
TAKADA SHINGO (JP)
ABE FUMIAKI (JP)
NARA SAORI (JP)
ASANO KIICHI (JP)
Application Number:
PCT/JP2021/009702
Publication Date:
September 30, 2021
Filing Date:
March 11, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C01F7/02; C01F7/44; C08G75/0213; C08G75/0259; C08K7/14; C08L81/02; C08L101/02
Domestic Patent References:
| WO2019208706A1 | 2019-10-31 | |||
| WO2019208377A1 | 2019-10-31 | |||
| WO2013141363A1 | 2013-09-26 | |||
| WO2013039103A1 | 2013-03-21 |
Foreign References:
| JP2013076039A | 2013-04-25 | |||
| JP2019123664A | 2019-07-25 | |||
| JP2003041019A | 2003-02-13 | |||
| JP2001072866A | 2001-03-21 | |||
| JP2006036833A | 2006-02-09 | |||
| JP2017088688A | 2017-05-25 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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