Title:
RESIN COMPOSITION, OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/067544
Kind Code:
A1
Abstract:
The present invention pertains to a resin composition containing a transparent resin and a light-absorbing agent, wherein a cured product of the resin composition has an absorption maximum wavelength in a range of 550-720 nm wavelength.
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Inventors:
WENG YUFENG (JP)
FUJII HIRONAKA (JP)
FUJII HIRONAKA (JP)
Application Number:
PCT/JP2019/038425
Publication Date:
April 02, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08L101/12; C08K3/00; C08K5/00; C08L63/00; C08L83/04; H01L33/56
Foreign References:
JP2015086357A | 2015-05-07 | |||
JP2016115779A | 2016-06-23 | |||
JP2014137462A | 2014-07-28 | |||
JPH07325391A | 1995-12-12 | |||
JP2003086846A | 2003-03-20 | |||
JP2018185893A | 2018-11-22 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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