Title:
RESIN COMPOSITION AND PLANAR CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2021/085224
Kind Code:
A1
Abstract:
[Problem] To provide: a resin composition able to give a planar connector in which few foreign bodies are present and which is excellent in terms of flatness, weld strength and crack resistance; and a planar connector obtained using said resin composition. [Solution] Provided is a resin composition that contains (A) a wholly aromatic polyester, (B) a fibrous filler and (C) a plate-shaped filler. Component (A) contains constituent units (I) to (IV) as essential constituent units. The content values of constituent units (I), (II), (III) and (IV) fall within prescribed mol% ranges relative to the overall amount of all constituent units. The difference between the content of constituent unit (III) and the content of constituent unit (IV) is 0.150 mol% or less. The content of the wholly aromatic polyester (A) is 50-62.5 mass%. The content of component (B) is 10-25 mass% relative to the overall resin composition. The content of component (C) is 25-40 mass% relative to the overall resin composition. The total amount of components (B) and (C) is 37.5-50 mass% relative to the overall resin composition. The weight-average fiber length of component (B) is 200-500 µm.
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Inventors:
FUKATSU HIROKI (JP)
NAGAE AKIHIRO (JP)
NAGAE AKIHIRO (JP)
Application Number:
PCT/JP2020/039318
Publication Date:
May 06, 2021
Filing Date:
October 20, 2020
Export Citation:
Assignee:
POLYPLASTICS CO (JP)
International Classes:
C08L67/00; C08K7/00; H01R13/46
Domestic Patent References:
| WO2014050370A1 | 2014-04-03 |
Foreign References:
| JP2003268252A | 2003-09-25 | |||
| JP2006037061A | 2006-02-09 |
Attorney, Agent or Firm:
SONODA & KOBAYASHI INTELLECTUAL PROPERTY LAW (JP)
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