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Patent Searching and Data


Title:
RESIN COMPOSITION FOR PLATING, AND PLATED MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2018/008669
Kind Code:
A1
Abstract:
Provided are a resin composition for plating and a plated molded article, the resin composition having excellent impact resistance and fluidity, and an excellent balance between plating adhesive strength, plating deposition properties, and thermal cycling properties. This resin composition for plating contains a polycarbonate resin (A), a graft copolymer (B), and a copolymer (C), and satisfies the following conditions (1) - (5). (1) The content of the polycarbonate resin (A) is 20-60 mass%, with respect to 100 mass% of the total of (A), (B), and (C). (2) The graft copolymer (B) is formed by graft-polymerizing a rubber polymer and a monomer component containing an aromatic vinyl monomer. (3) The copolymer (C) is formed by polymerizing a monomer component containing a vinyl cyanide monomer and an aromatic vinyl monomer. (4) The content of the rubber polymer is 7-20 mass% with respect to the resin composition. (5) The content of an oligomer component is less than 1 mass% with respect to the resin composition.

Inventors:
FUJIWARA TAKAYOSHI (JP)
MATSUMOTO NANA (JP)
Application Number:
PCT/JP2017/024593
Publication Date:
January 11, 2018
Filing Date:
July 05, 2017
Export Citation:
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Assignee:
NIPPON A&L INC (JP)
International Classes:
C08L69/00; C08F253/00; C08L25/12; C08L51/04; C25D5/56
Foreign References:
CN102719076A2012-10-10
JP2007197695A2007-08-09
JP2015108075A2015-06-11
JP2014074159A2014-04-24
JP2002528589A2002-09-03
JPH10279789A1998-10-20
JP2003327817A2003-11-19
Attorney, Agent or Firm:
GOTO & CO. (JP)
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