Title:
RESIN COMPOSITION, PREPREG, RESIN-ATTACHED FILM, RESIN-ATTACHED METAL FOIL, METAL-CLAD LAYERED BOARD, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/261308
Kind Code:
A1
Abstract:
This resin composition contains a curable resin. In the present invention, according to dynamic viscoelasticity measurement, the minimum value (Min) of the ratio of the loss elastic modulus (E") to the storage elastic modulus (E'), which is loss tangent (tanδ = E"/E'), of a cured product of this resin composition is 0.04 or greater at 100℃ to 200℃ .
Inventors:
YASUMOTO JUN
WATANABE RIHOKO
WASHIO TEPPEI
INOUE HIROHARU
WATANABE RIHOKO
WASHIO TEPPEI
INOUE HIROHARU
Application Number:
PCT/JP2021/022470
Publication Date:
December 30, 2021
Filing Date:
June 14, 2021
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L101/00; B29B11/16; B32B15/08; C08L25/04; H05K1/03; B29K105/06
Foreign References:
| JP2016196549A | 2016-11-24 | |||
| JP2020002217A | 2020-01-09 | |||
| JP2019044128A | 2019-03-22 | |||
| JP2019173010A | 2019-10-10 | |||
| JP2020033472A | 2020-03-05 | |||
| JP2017002305A | 2017-01-05 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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