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Title:
RESIN COMPOSITION, AND PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAID RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/101056
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a resin composition containing: a compound (A) containing at least one selected from polyfunctional vinyl aromatic copolymers (A-1) that have a repeating unit (a1) derived from a divinyl aromatic compound and a repeating unit (a2) derived from a monovinyl aromatic compound, the repeating unit (a1) constituting at least 2 mol% to less than 95 mol%, and the repeating unit (a2) constituting at least 5 mol% to less than 98 mol%, where the total of the repeating unit (a1) and the repeating unit (a2) is regarded as 100 mol%, and hydrocarbon compounds (A-2) that are represented by formula (1); and a phosphorus-containing compound (B) represented by formula (2).

Inventors:
SAITO HIROSUKE
HAGIWARA TAKAHITO
KASHIHARA KEIKO
Application Number:
PCT/JP2023/036787
Publication Date:
May 16, 2024
Filing Date:
October 10, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L25/02; B32B15/08; C08F212/34; C08J5/24; C08K5/5313; H05K1/03
Domestic Patent References:
WO2022202742A12022-09-29
WO2006059750A12006-06-08
Foreign References:
JP2019529677A2019-10-17
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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