Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED BOARD, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/060181
Kind Code:
A1
Abstract:
One aspect of the present invention pertains to a resin composition characterized by containing: a modified polyphenylene ether compound terminal-modified to a substituent having a carbon-carbon unsaturated double bond; and a free radical compound, wherein the free radical compound has, in the molecule, at least one free radical group selected from the group consisting of structures represented by formulas (1), (2), (3) and (4).

Inventors:
WADA ATSUSHI
KODA MASASHI
KOZAWA RYUSEI
KITAI YUKI
Application Number:
PCT/JP2020/035436
Publication Date:
April 01, 2021
Filing Date:
September 18, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B32B5/00; B32B15/08; B32B27/00; B32B27/26; C08F299/02; C08J5/24; C08K5/3412; C08L71/12; H05K1/03
Foreign References:
JP2018028078A2018-02-22
JP2019001965A2019-01-10
JP2007524736A2007-08-30
JP2010189517A2010-09-02
JP2006008750A2006-01-12
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
Download PDF: