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Title:
RESIN COMPOSITION, AND PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATED PLATE, AND WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2024/101054
Kind Code:
A1
Abstract:
One aspect of the present invention relates to a resin composition comprising: a hydrocarbon-based compound (A) represented by formula (1) [in formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and including at least one selected from an aromatic cyclic group and an aliphatic cyclic group; and n represents an integer of 1 to 10]; a polyphenylene ether compound (B) having a reactive carbon-carbon unsaturated double bond; and at least one of a polyfunctional vinyl aromatic copolymer (C) and an acenaphthylene compound (D).

Inventors:
SAITO HIROSUKE
NISHIGUCHI YASUNORI
KASHIHARA KEIKO
HAGIWARA TAKAHITO
Application Number:
PCT/JP2023/036782
Publication Date:
May 16, 2024
Filing Date:
October 10, 2023
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08F290/14; B32B15/08; C08G61/02; C08J5/24; H05K1/03
Domestic Patent References:
WO2022207741A12022-10-06
WO2020017399A12020-01-23
WO2022202742A12022-09-29
WO2019208471A12019-10-31
WO2018181842A12018-10-04
WO2017115813A12017-07-06
WO2021100658A12021-05-27
WO2022244726A12022-11-24
WO2022244723A12022-11-24
WO2022244725A12022-11-24
WO2022244728A12022-11-24
Foreign References:
JP2016079354A2016-05-16
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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