Title:
RESIN COMPOSITION FOR PROVISIONAL FIXATION, SUPPORT TAPE FOR SUBSTRATE CONVEYANCE AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/084708
Kind Code:
A1
Abstract:
A resin composition for provisional fixation for provisionally affixing a support for substrate conveyance to an organic substrate, said resin composition containing a thermoplastic resin, a thermosetting resin and an inorganic filler. If this resin composition for provisional fixation is formed into a film, the film has an elastic modulus of from 350 MPa to 550 MPa at 25°C after being heated at 130°C for 30 minutes and at 170°C for 2 hours.
Inventors:
TANAKA MIKA (JP)
SOBUE SHOGO (JP)
IRIZAWA SHINJI (JP)
OGAWA SAEKO (JP)
SOBUE SHOGO (JP)
IRIZAWA SHINJI (JP)
OGAWA SAEKO (JP)
Application Number:
PCT/JP2019/042884
Publication Date:
May 06, 2021
Filing Date:
October 31, 2019
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
H01L21/683; H01L21/301
Foreign References:
| JP2016216572A | 2016-12-22 | |||
| JP2019151696A | 2019-09-12 | |||
| JP2019114599A | 2019-07-11 | |||
| JP2013194103A | 2013-09-30 | |||
| JP2011151125A | 2011-08-04 | |||
| JP2009049253A | 2009-03-05 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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