RESIN COMPOSITION FOR SEALING, AND SEMICONDUCTOR DEVICE

Title:

RESIN COMPOSITION FOR SEALING, AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2021/187240

Kind Code:

A1

Abstract:

The present disclosure provides a resin composition for sealing, which can be used to produce a sealing material, readily increases adhesion between a sealing material and nickel, and is unlikely to suffer from adverse effects caused thereby. The resin composition for sealing contains an epoxy resin (A), a phenolic curing agent (B), an inorganic filler (C) and a carboxylic acid (D) having a melting point of 80-200ºC. The ratio of the total amount of carboxyl groups in the carboxylic acid (D) relative to the total amount of the epoxy resin (A), the phenolic curing agent (B) and the carboxylic acid (D) is 0.01-10 mass%.

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Inventors:

SUGIYAMA HIROSHI
OISHI YUSUKE

Application Number:

PCT/JP2021/009285

Publication Date:

September 23, 2021

Filing Date:

March 09, 2021

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

C08G59/06; C08G59/62; C08K3/013; C08K5/09; C08L61/06; C08L63/00; H01L23/29; H01L23/31

Foreign References:

JPS60219756A	1985-11-02
JP2014114426A	2014-06-26
JP2018058960A	2018-04-12
JP2019214666A	2019-12-19
JP2004027005A	2004-01-29