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Title:
RESIN COMPOSITION FOR SECURITY CARD, SHEET FOR SECURITY CARD, MULTILAYERED OBJECT, AND SECURITY CARD
Document Type and Number:
WIPO Patent Application WO/2022/107488
Kind Code:
A1
Abstract:
Provided are: a resin composition capable of providing sheets which have excellent lamination performance and give multilayered objects having excellent resistance to bending and which have excellent laser markability; and a security-card sheet obtained using the resin composition, a multilayered object, and a security card. The resin composition for security cards includes a polycarbonate resin having a terminal structure represented by formula (1). In formula (1), R1 represents a C8-C36 alkyl group or a C8-C36 alkenyl group; the R2 moieties each independently represent a halogen atom, a C1-C20 alkyl group, or a C6-C12 aryl group; n indicates an integer of 0-4; and symbol * is a site of combining with the polycarbonate resin.

Inventors:
OHNO SHOTARO (JP)
SUZUKI KENTARO (JP)
NAKAJIMA MAMORU (JP)
TAKEDA MASAHIDE (JP)
Application Number:
PCT/JP2021/037362
Publication Date:
May 27, 2022
Filing Date:
October 08, 2021
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
MGC FILSHEET CO LTD (JP)
International Classes:
C08G64/08; B32B27/36; C08J5/18; C08K3/013; C08K3/08; C08K5/3417; C08L69/00
Domestic Patent References:
WO2017104482A12017-06-22
Foreign References:
JP2018103518A2018-07-05
JP2019002023A2019-01-10
Attorney, Agent or Firm:
SIKS & CO. (JP)
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