Title:
RESIN COMPOSITION AND SEMICONDUCTOR SEALING MATERIAL USING SAME, IMPREGNATED BASE MATERIAL, CIRCUIT BASE BOARD, BUILD-UP FILM, PREPREG, CARBON FIBER COMPOSITE MATERIAL, SOLDER RESIST, DRY FILM, AND PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/039111
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing an epoxy resin composition capable of achieving both thermal resistance and lowered elasticity or both thermal resistance and toughening, depending on the purpose, and is excellent for tight adhesion of a copper foil. [Solution] This thermosetting resin composition is characterized by comprising a thermosetting resin and a modified resin, wherein the modified resin is a block polymer yielded by bonding n polymer A blocks to an n-valent polymer B block, and the total content percentage of polyether units, conjugated diene polymer units, hydrogenated conjugated diene polymer units, and polysiloxane units in the polymer B block is 70% by mass or greater, said n being an integer of 2 or greater.
Inventors:
MATSUMURA YUUSUKE (JP)
NAKAMURA AKIFUMI (JP)
NAKAMURA AKIFUMI (JP)
Application Number:
PCT/JP2020/025947
Publication Date:
March 04, 2021
Filing Date:
July 02, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/00; B32B15/08; B32B15/092; B32B15/20; C08G59/17; C08G81/00; C08J5/24; C08L53/00; C08L63/00; C08L67/04; C08L101/00; G03F7/004; H01L23/29; H01L23/31; H05K3/28
Foreign References:
| JP2017095691A | 2017-06-01 | |||
| JP2009269999A | 2009-11-19 | |||
| JP2008195875A | 2008-08-28 | |||
| JP2008156392A | 2008-07-10 | |||
| JP2005213374A | 2005-08-11 | |||
| JPH02107659A | 1990-04-19 | |||
| JPH04216855A | 1992-08-06 | |||
| JP2017082213A | 2017-05-18 | |||
| JP2001310989A | 2001-11-06 | |||
| JPS59199712A | 1984-11-12 | |||
| JP2000344716A | 2000-12-12 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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