Title:
RESIN COMPOSITION SUITABLE FOR USE AS FILM FOR FILM CAPACITOR
Document Type and Number:
WIPO Patent Application WO/2021/070863
Kind Code:
A1
Abstract:
Provided is a technique for obtaining films having higher dielectric breakdown strength and higher folding endurance at high temperatures. The present invention provides a resin composition which comprises (1) a syndiotactic polystyrene resin, (2) a poly(phenylene ether) resin, and (3) at least one elastomer or resin selected from the group consisting of styrene-based thermoplastic elastomers and atactic polystyrene resins, the resin composition having a content of the poly(phenylene ether) resin of 6 mass% or higher.
Inventors:
SUEI TAKUMI (JP)
IKEDA KAZUO (JP)
KAKEHI AKIHIRO (JP)
IKEDA KAZUO (JP)
KAKEHI AKIHIRO (JP)
Application Number:
PCT/JP2020/037998
Publication Date:
April 15, 2021
Filing Date:
October 07, 2020
Export Citation:
Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
C08J5/18; C08L25/06; C08L53/02; C08L71/12; H01G4/32
Domestic Patent References:
WO2016080356A1 | 2016-05-26 |
Foreign References:
JP2002356593A | 2002-12-13 | |||
JP2000080228A | 2000-03-21 | |||
JPH0952959A | 1997-02-25 | |||
JPH08323878A | 1996-12-10 | |||
JP2017036373A | 2017-02-16 |
Attorney, Agent or Firm:
SAEGUSA & PARTNERS (JP)
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