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Title:
RESIN COMPOSITION, WIRING BOARD AND METHOD FOR PRODUCING CONDUCTIVE PATTERN
Document Type and Number:
WIPO Patent Application WO/2021/193354
Kind Code:
A1
Abstract:
The present invention provides a resin composition which is capable of forming a pattern that achieves a good balance between adhesion and good dispersibility (i. e. good conductivity in cases where the resin composition contains conductive particles) even if the pattern is a fine pattern.　A resin composition which contains fine particles, a compound (B) that has a structure represented by general formula (1) and a functional group that produces an amino group by means of heat, and a binder resin (C), wherein the fine particles are composed of an organic pigment (F) or inorganic particles (G) that have coating layers containing carbon. (In general formula (1), X represents an Si, Ti or Zr atom; each of R1 to R3 independently represents a hydroxy group, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group, an isobutoxy group or a hydrocarbon group having from 1 to 6 carbon atoms; and the R1 to R3 moieties may be the same as or different from each other, provided that at least one of the moieties is a hydroxy group, a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, a butoxy group or an isobutoxy group.)

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Inventors:
HIBINO TOSHIYASU (JP)
KONOSHIMA YOHEI (JP)
MITSUI HIROKO (JP)
YAMASHIKI YUKA (JP)
INOUE YOSHIHIKO (JP)
Application Number:
PCT/JP2021/011087
Publication Date:
September 30, 2021
Filing Date:
March 18, 2021
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08K5/16; C08K9/00; C08L101/00; G03F7/004; G03F7/023; G03F7/20; H01B1/22; H01B13/00; H05K1/09; H05K3/02
Foreign References:
JP2019191549A2019-10-31
JP2010102086A2010-05-06
JP2016050231A2016-04-11
JP2013195997A2013-09-30
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