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Patent Searching and Data


Title:
RESIN COMPOSITION, WRAPPING FILM, AND WRAPPING FILM HOUSING BODY
Document Type and Number:
WIPO Patent Application WO/2020/070836
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition containing a thermoplastic resin and a compound having an epoxy group and a partial structure represented by formula (1). In formula (1), R1 represents an alkylene group.

Inventors:
MIYATA HIROYUKI (JP)
SAHARA SHUNYA (JP)
EBINUMA KAZUHIRO (JP)
Application Number:
PCT/JP2018/037077
Publication Date:
April 09, 2020
Filing Date:
October 03, 2018
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L101/00; C08L27/06; C08L63/00; C08L91/00
Domestic Patent References:
WO2013084707A12013-06-13
Foreign References:
JP2016522283A2016-07-28
JPS5998155A1984-06-06
JPH0421691A1992-01-24
JP2007246483A2007-09-27
Other References:
SUMAN, MICHELE ET AL.: "Liquid Chromatography- Electrospray Ionization-Tandem Mass Spectrometry Method for the Determination of Epoxidized Soybean Oil in Food Products", J. AGRIC. FOOD CHEM., vol. 53, 2005, pages 9879 - 9884, XP055700078
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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