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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/117756
Kind Code:
A1
Abstract:
The present invention is a resin composition containing: an additively polymerized resin α having a glass transition temperature of 150°C or higher; and a resin β comprising an aromatic dicarboxylic acid monomer unit A that has a hydrophilic group, and a dicarboxylic acid monomer unit B that does not have a hydrophilic group. According to the present invention, it is possible to provide a resin composition that is easily removable via water while still retaining heat resistance.

Inventors:
ONOUE AKIHIRO (JP)
YOSHIMURA TADANORI (JP)
Application Number:
PCT/JP2020/045795
Publication Date:
June 17, 2021
Filing Date:
December 09, 2020
Export Citation:
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Assignee:
KAO CORP (JP)
International Classes:
C08L101/02; C08L45/00; C08L101/00
Domestic Patent References:
WO2018139537A12018-08-02
Foreign References:
JP2006096969A2006-04-13
JP2012131123A2012-07-12
JP2008506022A2008-02-28
JPH0543800A1993-02-23
JP2020125468A2020-08-20
JP2018024243A2018-02-15
JP2017114930A2017-06-29
Other References:
See also references of EP 4074780A4
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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