Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/113941
Kind Code:
A1
Abstract:
One embodiment of the present invention relates to a resin composition and a method for producing a resin composition. The resin composition contains 100 parts by volume of a resin (A) and 230-640 parts by volume of a filler (B) having an average particle diameter of 5-60 µm. The filler (B) contains a spherical filler (B-1) having an average particle diameter of 0.1-0.7 µm and a filler (B-2) having at least a peak within the range 0.9-3.0 µm in a particle size distribution measured using a laser diffraction method. The proportion of the filler (B-1) is 0.2-5.0 vol.% relative to 100 vol.% of the filler (B).
Inventors:
FUJII SAIKO (JP)
INAKI YOSHITAKA (JP)
INAKI YOSHITAKA (JP)
Application Number:
PCT/JP2021/042825
Publication Date:
June 02, 2022
Filing Date:
November 22, 2021
Export Citation:
Assignee:
TOKUYAMA CORP (JP)
International Classes:
C08L101/00; C08K3/013; C08K3/22; C08K3/28; C08K7/18
Domestic Patent References:
WO2016125664A1 | 2016-08-11 | |||
WO2020137339A1 | 2020-07-02 | |||
WO2019230969A1 | 2019-12-05 |
Foreign References:
JP2016216523A | 2016-12-22 | |||
JP2017137454A | 2017-08-10 | |||
JP2018162366A | 2018-10-18 | |||
JP2020132827A | 2020-08-31 | |||
JP2012111927A | 2012-06-14 | |||
JP2016216523A | 2016-12-22 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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