Title:
RESIN FOAM
Document Type and Number:
WIPO Patent Application WO/2021/106913
Kind Code:
A1
Abstract:
Provided is a resin foam that is thin, has excellent shock absorbency, and is hard to collapse. This resin foam has a 50% compression load of at least 5N/cm2 and a compressive modulus of elasticity of at least 200 kPa and has a bubble structure. In one embodiment of the present invention, the resin foam has an elastic distortion energy of at least 10 kPa when compressed. In one embodiment of the present invention, this resin foam has a non-foam bending stress of at least 5 MPa. In one embodiment of the present invention, this resin foam has a modulus of elasticity at 23°C of at least 0.6 MPa.
Inventors:
KODAMA KIYOAKI (JP)
ISEKI TORU (JP)
SASAKI SHOGO (JP)
ISEKI TORU (JP)
SASAKI SHOGO (JP)
Application Number:
PCT/JP2020/043762
Publication Date:
June 03, 2021
Filing Date:
November 25, 2020
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C08J9/12; B32B5/18; B32B27/32
Domestic Patent References:
| WO2015146756A1 | 2015-10-01 |
Foreign References:
| JP2016088977A | 2016-05-23 | |||
| JP2001348452A | 2001-12-18 |
Attorney, Agent or Firm:
MOMII Takafumi (JP)
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