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Patent Searching and Data


Title:
RESIN FORMED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/162790
Kind Code:
A1
Abstract:
This resin formed product comprises: a main body portion having a first foam layer formed therein, a design surface, and an opposite surface opposing the design surface; and an extending portion located in a peripheral edge portion of the main body portion, extending toward the side opposite from the design surface in the thickness direction of the main body portion, and having a second foam layer formed therein. The extending portion has a protruding end portion provided in such a manner that the forward end portion thereof on the extended design surface side protrudes further than the forward end portion thereof on the extended opposite surface side in the extending direction of the extending portion. The protruding end portion has a thickness of 1.2 mm or thinner.

Inventors:
SHIOKAWA, Hirofumi (JP)
Application Number:
PCT/JP2021/002855
Publication Date:
August 04, 2022
Filing Date:
January 27, 2021
Export Citation:
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Assignee:
SHOWA DENKO MATERIALS CO., LTD. (JP)
International Classes:
B29C44/00; B29C44/34
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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