Title:
RESIN LAMINATE FOR LOW-DIELECTRIC MATERIAL
Document Type and Number:
WIPO Patent Application WO/2021/065968
Kind Code:
A1
Abstract:
A resin laminate for low-dielectric material, having a total of at least three laminated layers, comprising, layered alternately, a resin layer (S) that includes a styrene resin (S1) having a syndiotactic structure and a resin layer (M) that includes a resin (M1) having a softening point of no more than 260° C. The outermost layers are resin layers (S).
Inventors:
IWAMOTO TAKEHIRO (JP)
Application Number:
PCT/JP2020/037053
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
Assignee:
IDEMITSU KOSAN CO (JP)
International Classes:
B32B27/30; H05K1/03
Foreign References:
| JPH0922616A | 1997-01-21 | |||
| JP2011088387A | 2011-05-06 | |||
| JP2002086635A | 2002-03-26 | |||
| JPH06190997A | 1994-07-12 | |||
| JP2016030419A | 2016-03-07 | |||
| JP2014019017A | 2014-02-03 |
Other References:
PLASTICS PROCESSING DATABOOK (2ND EDITION), 28 January 2002 (2002-01-28), pages 2 - 3
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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