RESIN MOLD FRAME AND METHOD FOR MANUFACTURING RESIN MOLD FRAME

WIPO Patent Application WO/2021/166349

A1

[Problem] The purpose of the present invention is to provide: a resin mold frame that is unlikely to be damaged and has excellent durability because a predetermined strength is imparted to said resin mold frame and detachment of a resin layer from a frame body during release is suppressed; and a method for manufacturing the resin mold frame. [Solution] As illustrated in FIG. 1, a resin mold frame A has a two-layer structure comprising: a frame body 1; and a resin layer 2 with which the frame body 1 is coated. In addition, the resin mold frame A is formed from a substantially box-shaped main body A1 that is open at a lower portion and a base part A2 that is provided on the opposite side to an opening edge part A10 side of the main body A1. The frame body 1 is made of metal in this example, and the frame body 1 has predetermined rigidity required to maintain the shape of the resin mold frame A.　The resin layer 2 is provided to cover, at a thickness of about 20 mm, an outer-side surface 10c1 of each support plate 10c of the frame body 1, an outer-side surface 10b1 of an intermediate stepped plate 10b, and an outer-side surface 11a of a base part 11. In the surface on the opposite side of the surface of the resin layer 2 coated with the frame body 1, a mold surface 20 reproducing the surface of a later-described concrete product C is formed when manufacturing the concrete product C.

JP2787281	INDUSTRIAL APPLICABILITY: A decorative mold for forming a concrete surface having an uneven pattern and a method for forming a concrete surface having an uneven pattern.
JP3089244	[Title of the Invention] A method for manufacturing a resin mold for molding a concrete product.
JP2668824	CONCRETE MOLDED PRODUCT AND MANUFACTURING DEVICE

MORIYAMA YOSHIHARU (JP)

PCT/JP2020/043141

August 26, 2021

November 19, 2020

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MORIYAMA IND CO LTD (JP)

B28B7/34

JP2001071317A	2001-03-21
JPS61122806U	1986-08-02
JP3007457U	1995-02-14

ARIYOSHI Shuichiro et al. (JP)

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