Title:
RESIN MOLDED ARTICLE, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2015/129237
Kind Code:
A1
Abstract:
In an interface between a sealed surface (11) in a thermosetting resin member (10) and a thermoplastic resin member (20) sealing the sealed surface, a newly-created surface (14) is formed, the newly-created surface being obtained by removing a contaminant on the sealed surface. In addition, a functional group present on the newly-created surface is chemically bonded to a functional group present in a functional group-containing additive (20a), the functional group-containing additive being added to a constituent material of the thermoplastic resin member. This chemical bond enables the obtainment of high adhesiveness between the thermosetting resin member and the thermoplastic resin member.
Inventors:
HARADA TOMOYUKI (JP)
IZUMI RYOSUKE (JP)
YAMAKAWA HIROYUKI (JP)
IZUMI RYOSUKE (JP)
YAMAKAWA HIROYUKI (JP)
Application Number:
PCT/JP2015/000857
Publication Date:
September 03, 2015
Filing Date:
February 23, 2015
Export Citation:
Assignee:
DENSO CORP (JP)
International Classes:
H01L21/56; B29C65/00; B29C69/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2014013697A1 | 2014-01-23 |
Foreign References:
| JP2002326220A | 2002-11-12 | |||
| JP2002329815A | 2002-11-15 | |||
| JP2011014863A | 2011-01-20 | |||
| JP2002186129A | 2002-06-28 | |||
| JP2009117435A | 2009-05-28 | |||
| JP2012056289A | 2012-03-22 |
Attorney, Agent or Firm:
KIN, Junhi (JP)
Gold Junki (JP)
Gold Junki (JP)
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