Title:
RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/158913
Kind Code:
A1
Abstract:
The present invention provides a resin molded body which is capable of achieving a good balance between heat dissipation properties and flame retardancy at high levels. A resin molded body which contains an olefin resin, an expanded graphite, and a plate-like graphite that is different from the expanded graphite, and which is configured such that: the expanded graphite has an expansion ratio of from 50 ml/g to 600 ml/g (inclusive); the content of the expanded graphite is from 10 parts by weight to 300 parts by weight (inclusive) relative to 100 parts by weight of the olefin resin; the volume average particle diameter of the plate-like graphite is from 30 μm to 500 μm (inclusive); and the content of the plate-like graphite is from 10 parts by weight to 300 parts by weight (inclusive) relative to 100 parts by weight of the olefin resin.
Inventors:
SUENAGA YUUSUKE (JP)
MATSUMURA RYUUJI (JP)
MATSUMURA RYUUJI (JP)
Application Number:
PCT/JP2020/003620
Publication Date:
August 06, 2020
Filing Date:
January 31, 2020
Export Citation:
Assignee:
SEKISUI TECHNO MOLDING CO LTD (JP)
International Classes:
C08K7/00; C08L23/00
Foreign References:
| JP2006257174A | 2006-09-28 | |||
| JP2006233017A | 2006-09-07 | |||
| JP2010123564A | 2010-06-03 | |||
| CN109233185A | 2019-01-18 | |||
| JP2019167521A | 2019-10-03 | |||
| JP2013043949A | 2013-03-04 | |||
| JP2015189783A | 2015-11-02 |
Other References:
See also references of EP 3919555A4
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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