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Patent Searching and Data


Title:
RESIN MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/158913
Kind Code:
A1
Abstract:
The present invention provides a resin molded body which is capable of achieving a good balance between heat dissipation properties and flame retardancy at high levels. A resin molded body which contains an olefin resin, an expanded graphite, and a plate-like graphite that is different from the expanded graphite, and which is configured such that: the expanded graphite has an expansion ratio of from 50 ml/g to 600 ml/g (inclusive); the content of the expanded graphite is from 10 parts by weight to 300 parts by weight (inclusive) relative to 100 parts by weight of the olefin resin; the volume average particle diameter of the plate-like graphite is from 30 μm to 500 μm (inclusive); and the content of the plate-like graphite is from 10 parts by weight to 300 parts by weight (inclusive) relative to 100 parts by weight of the olefin resin.

Inventors:
SUENAGA YUUSUKE (JP)
MATSUMURA RYUUJI (JP)
Application Number:
PCT/JP2020/003620
Publication Date:
August 06, 2020
Filing Date:
January 31, 2020
Export Citation:
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Assignee:
SEKISUI TECHNO MOLDING CO LTD (JP)
International Classes:
C08K7/00; C08L23/00
Foreign References:
JP2006257174A2006-09-28
JP2006233017A2006-09-07
JP2010123564A2010-06-03
CN109233185A2019-01-18
JP2019167521A2019-10-03
JP2013043949A2013-03-04
JP2015189783A2015-11-02
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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