Title:
RESIN MOLDED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2018/055798
Kind Code:
A1
Abstract:
A resin molded component 1 comprises: a first thin part 4; a thick part 3 thicker than the first thin part 4 and surrounding the periphery of the first thin part 4; and segmentation parts 9A and 9B thinner than the thick part 1 and segmenting the thick part 3. The segmentation parts 9A and 9B segment the thick part 3 at a position spaced apart from a resin injecting position 2a compared with a tangential line X at the boundary between the first thin part 4 and the thick part 3 closest to the resin injecting position 2a during resin molding. The speed of molten resin is reduced at the segmentation parts 9A and 9B, whereby a state in which the molten resin flowing through the thick part 3 goes around to the front of the path of the molten resin flowing through the first thin part 4 is made difficult to occur.
Inventors:
ISHII TAKAYUKI (JP)
ABE KAZUHIRO (JP)
ABE KAZUHIRO (JP)
Application Number:
PCT/JP2017/009564
Publication Date:
March 29, 2018
Filing Date:
March 09, 2017
Export Citation:
Assignee:
ALPS ELECTRIC CO LTD (JP)
International Classes:
B29C33/42
Foreign References:
| JP2014162097A | 2014-09-08 | |||
| JP2008302667A | 2008-12-18 | |||
| JP2008107376A | 2008-05-08 | |||
| JP2003326567A | 2003-11-19 | |||
| JP2012153039A | 2012-08-16 | |||
| JPH08224762A | 1996-09-03 | |||
| JP2010105363A | 2010-05-13 |
Attorney, Agent or Firm:
MATSUSHITA, Masahiro (JP)
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