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Patent Searching and Data


Title:
RESIN MOLDING DEVICE AND MANUFACTURING METHOD FOR RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/217703
Kind Code:
A1
Abstract:
Provided is a resin molding device capable of reducing variation in the thicknesses of resins to be formed. This resin molding device 1000 is characterized by including a forming mold having one mold 1100 and the other mold 1200, a one mold-side wedge mechanism 1310, and a one mold-side cavity block drive mechanism 1301, wherein: a one mold-side cavity block 1101 is moved to a preset height position using the one mold-side cavity block drive mechanism 1301; a resin is injected into a one mold-side cavity 1106 in a state in which the one mold-side cavity block 1101 that has been moved to the height position is fixed by using the one mold-side wedge mechanism 1310 so that the position thereof in a direction away from the other mold 1200 is restricted; and then, resin forming can be performed by changing the depth of the one mold-side cavity 1106 using the one mold-side wedge mechanism 1310 and the one mold-side cavity block drive mechanism 1301.

Inventors:
OKUNISHI YOSHITO (JP)
OGAWA FUYUHIKO (JP)
Application Number:
PCT/JP2020/008030
Publication Date:
October 29, 2020
Filing Date:
February 27, 2020
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C45/02; B29C33/12; B29C45/14; B29C45/26; B29C45/36
Foreign References:
JP2017162888A2017-09-14
JP2013028087A2013-02-07
JPH01201927A1989-08-14
JP2006319226A2006-11-24
JPS5667210A1981-06-06
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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