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Patent Searching and Data


Title:
RESIN MOLDING DEVICE AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/217702
Kind Code:
A1
Abstract:
Provided is a resin molding device that can reduce a molding problem caused by a fluctuation in the thickness of an object to be molded or reduce a fluctuation in the thickness of a resin molded portion, and that can perform a mold releasing operation. A resin molding device 1000 comprises: a molding mold having one mold 1100 and the other mold 1200; one mold wedge mechanism 1310; and one mold cavity block driving mechanism 1301, characterized in that, in a state in which a height position of one mold cavity block 1101 is set using the one mold cavity block driving mechanism 1301 and a position in a direction away from the other mold in the one mold cavity block 1101 having been moved to the height position is fixed to be limited using the one mold wedge mechanism 1310, a mold releasing operation is enabled using the one mold wedge mechanism 1310 and the one mold cavity block driving mechanism 1301.

Inventors:
OKUNISHI YOSHITO (JP)
OGAWA FUYUHIKO (JP)
SAKAI HIDEYUKI (JP)
Application Number:
PCT/JP2020/008028
Publication Date:
October 29, 2020
Filing Date:
February 27, 2020
Export Citation:
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Assignee:
TOWA CORP (JP)
International Classes:
B29C45/02; B29C33/12; B29C45/14; B29C45/26; B29C45/36; B29C45/40
Foreign References:
JP2017162888A2017-09-14
JP2013028087A2013-02-07
JPH01201927A1989-08-14
JP2006319226A2006-11-24
JPS5667210A1981-06-06
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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