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Patent Searching and Data


Title:
RESIN MOLDING DIE AND RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/203889
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technology that enables improvement on molding quality. The problem is solved by a resin molding die (10) provided with: a cavity (C); a shut-off vent (26) that is connected to the cavity (C); a shut-off pin (40) that is capable of advancing/retreating to/from the shut-off vent (26); a return spring (41) that separates the shut-off pin (40) away from the shut-off vent (26); an air supply channel (42) that applies air pressure on the shut-off pin (40) against the force of the return spring (41); and an overflow cavity (25) that is connected to the cavity (C) at a place on the cavity (C) side of the shut-off vent (26).

Inventors:
MAEKAWA MASANORI (JP)
TAJIMA SHINYA (JP)
KITAJIMA TOKUYUKI (JP)
NAGUMO NORIO (JP)
Application Number:
PCT/JP2017/015366
Publication Date:
November 30, 2017
Filing Date:
April 14, 2017
Export Citation:
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Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C39/26; B29C33/10
Foreign References:
JP2015093398A2015-05-18
JP2009292076A2009-12-17
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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