Title:
RESIN MOLDING METHOD, FILM CONVEYING DEVICE, AND RESIN MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/061316
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a technology that enables reduction of manufacturing and running cost of a molded article. As a solution, the present invention comprises: a molding step for covering a die surface (21a) with a roll-shaped release film (F) supplied from film loader hands (40) which are provided on both sides of a molding die (20), and performing, multiple times, a step for closing the mold to perform resin molding, opening the mold, and releasing the molded article from a cavity (C); and a film supplying step for supplying, when it is determined that the release film (F) is unsuitable for use, an unused part of the release film (F) to the molding die (20) after the mold is opened, wherein a position at which the film loader hand (40) holds the release film (F) is controlled such that the release film (F) is moved to a position adjacent to the die surface (21a) in the molding step, and the release film (F) is moved to a position apart from the die surface (21a) in the film supplying step.
Inventors:
NAKAZAWA HIDEAKI (JP)
FUJISAWA MASAHIKO (JP)
FUJISAWA MASAHIKO (JP)
Application Number:
PCT/JP2017/019994
Publication Date:
April 05, 2018
Filing Date:
May 30, 2017
Export Citation:
Assignee:
APIC YAMADA CORP (JP)
International Classes:
B29C33/68; B29C43/02; B29C43/50; H01L21/56
Foreign References:
| JP2005219210A | 2005-08-18 | |||
| JP2008302550A | 2008-12-18 | |||
| JP2000108159A | 2000-04-18 | |||
| JP2006027081A | 2006-02-02 | |||
| JP2009099850A | 2009-05-07 |
Attorney, Agent or Firm:
WATANUKI PATENT SERVICE BUREAU (JP)
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