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Patent Searching and Data


Title:
RESIN MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/217822
Kind Code:
A1
Abstract:
Provided is a resin molding method with which it is possible to reduce a use amount of a micropellet and obtain a resin molded article having a required characteristic. In the resin molding method, an arrangement step of arranging preliminary molded bodies (2) that are molded by being three-dimensionally laminated inside a molding mold (3), a filling step of heating and melting the preliminary molded bodies (2) by electromagnetic waves passing through the molding mold (3) and filling melted resin material (20) inside the molding mold (3), and a cooling step of cooling and solidifying the melted resin material (20) inside the molding mold (3) are performed. In the cooling step, a resin molded article integrated so as to remove laminate interfaces (21) of the preliminary molding bodies (2) is molded inside the molding mold (3).

Inventors:
KURIHARA FUMIO (JP)
KAGAWA SHINGO (JP)
Application Number:
PCT/JP2020/013086
Publication Date:
October 29, 2020
Filing Date:
March 24, 2020
Export Citation:
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Assignee:
MICRO AMS INC (JP)
International Classes:
B29C39/24; B29C33/38; B29C39/26; B29C39/38; B29C64/112; B29C64/118; B29C64/153; B29C69/02
Domestic Patent References:
WO2017213666A12017-12-14
WO2015194378A12015-12-23
Foreign References:
JP2018015148A2018-02-01
JP2015131479A2015-07-23
US20160332388A12016-11-17
Attorney, Agent or Firm:
AICHI, TAKAHASHI, IWAKURA & ASSOCIATES (JP)
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