Title:
RESIN PARTICLES, CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/230842
Kind Code:
A1
Abstract:
The present invention provides resin particles which are able to be effectively suppressed in aggregation, and which are capable of effectively enhancing adhesion to conductive parts if conductive particles are obtained by forming the conductive parts on the surfaces of the resin particles so as to be used for electrical connection between electrodes, while being also capable of effectively lowering the connection resistance. With respect to the resin particles according to the present invention, the ratio of the OH- ion strength to the total strength of all negative ions in the outer surfaces of the resin particles is 2.0 × 10-2 or more if a negative spectrum is obtained by means of time-of-flight secondary ion mass spectrometry.
Inventors:
KUBO ATSUKI (JP)
YAMADA YASUYUKI (JP)
YAMADA YASUYUKI (JP)
Application Number:
PCT/JP2020/019227
Publication Date:
November 19, 2020
Filing Date:
May 14, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08J3/00; C08F2/44; C08L51/06; C08L101/00; H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2009119788A1 | 2009-10-01 | |||
| WO2018230470A1 | 2018-12-20 |
Foreign References:
| JPH10259253A | 1998-09-29 | |||
| JP2013214509A | 2013-10-17 | |||
| JP2008521963A | 2008-06-26 | |||
| JP2001135141A | 2001-05-18 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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