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Title:
RESIN PARTICLES, ELECTRICALLY CONDUCTIVE PARTICLES, ELECTRICALLY CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/193911
Kind Code:
A1
Abstract:
A purpose of the present invention is to provide resin particles that have excellent resistance to heat, that, when used as base particles of electrically conductive particles, allows implementation of thermocompression bonding with a low pressure, and that can be used to obtain a connection structure having excellent connection reliability. Another purpose of the present invention is to provide: electrically conductive particles obtained by using the resin particles; an electrically conductive material; and a connection structure. The resin particles according to the present invention have a 5% weight loss temperature of 350°C or higher, a 10% K value of 100-2500 N/mm2 at 25°C, and a 30% K value of 100-1500 N/mm2 at 25°C.

Inventors:
OOKURA KOUKI (JP)
WAKIYA TAKESHI (JP)
Application Number:
PCT/JP2021/012831
Publication Date:
September 30, 2021
Filing Date:
March 26, 2021
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F22/40; C08J3/12; C23C18/31; H01B1/00; H01B1/22; H01B5/00; H01R11/01
Foreign References:
JP2012064559A2012-03-29
JP2019114552A2019-07-11
JPH07124866A1995-05-16
JP2010248470A2010-11-04
JP2012193325A2012-10-11
JP2017063033A2017-03-30
JP2017171724A2017-09-28
JP2018048309A2018-03-29
JP2019140116A2019-08-22
JP2001220691A2001-08-14
JP2008222879A2008-09-25
JP2006249380A2006-09-21
Other References:
KATSUYA ASAO: "doctoral dissertation", 2013, OSAKA PREFECTURE UNIVERSITY, article "Preparation and functionalities in BiFeO _ 3 based dielectric oxides"
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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