Title:
RESIN RESIDUE REMOVAL DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/158479
Kind Code:
A1
Abstract:
Provided is a resin residue removal device capable of appropriately removing a resin residue having adhered to the lower surface of a die in a molding apparatus. This resin residue removal device for removing a resin residue having adhered to the lower surface of a die in a molding apparatus comprises a movement means and a resin residue removal head, the movement means causing the resin residue removal head to move between a side position shifted from a position directly below the die and the position directly below the die, and, in the position directly below the die, between a separation position in which the head is separated from the lower surface of the die and a proximity position in which the head is proximate to the lower surface, and the resin residue removal head moving along the lower surface, and thereby allowing removal of a resin residue having adhered to the lower surface.
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Inventors:
TANJI TADATOSHI (JP)
Application Number:
PCT/JP2022/001742
Publication Date:
July 28, 2022
Filing Date:
January 19, 2022
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C49/04; B29C49/42
Domestic Patent References:
| WO2021024982A1 | 2021-02-11 |
Foreign References:
| JP2020032610A | 2020-03-05 | |||
| JP2014520005A | 2014-08-21 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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